Yas Viceroy Hotel in Abu Dhabi

Example of a 2.5D free form rigid electronic circuit (Yas Viceroy hotel in Abu Dhabi).

The TERASEL project envisions a world where non-intrusive electronics are integrated everywhere. To achieve this twenty-first century dream using reliable and economical techniques, the TERASEL consortium targets to exploit today’s technology in new and exciting ways. Free-form 2.5D and full 3D electronics are highly desirable for various reasons.

They offer various advantages like better aesthetics, higher user comfort, increased safety, reduced complexity, ecological products due to lower material usage, design freedom, and many others.

The aim of the TERASEL project is to establish and demonstrate a complete industrial production chain for the fabrication of randomly shaped electronics and sensor circuits. In this project the EU research institutes and companies leading the worldwide technology developments and industrialization efforts on large area elastic circuits will take full advantage of their position to tackle the challenge of developing, applying and industrializing the technology for thermoplastic one-time deformable circuits.

To achieve this daunting task in three short years the TERASEL project revisits the stretchable electronics technology developed in previous European projects like STELLA (Stretchable Electronics for Large Area Applications) and Place-It (Platform for Large Area Conformable Electronics by inTegration). TERASEL offers three technologies to achieve this goal, each coming with its own advantages. Compared to the competing technologies some of the key advantages are the capability to integrate a wide variety of electronic components, support for power applications with high currents and voltages, and usage of standard equipment from the circuit board industry. All of this is made possible by starting from a conventional flat substrate with a stretchable circuit which is deformed to the desired 2.5D or 3D later on using conventional thermoforming.

More information: Project Fact Sheet